Liquid cooled heat sinks are cooling systems used to dissipate heat from high-performance electronic devices such as CPUs, GPUs, and high-power amplifiers. They consist of a heat sink base that is in direct contact with the hot device, and a liquid (usually water or a water-based coolant) that flows through heat sink to absorb the heat. High performance liquid cooled heat sinks offer efficient way to manage electronic systems with highly concentrated power and heat.
We produce all kinds of liquid cooled heat sinks / cold plates with technologies: high precision CNC machining, vacuum brazing, friction stir welding (FSW), etc..
The heat sinks can be produced with copper or aluminum alloy, with surface treatment such as nickel plating for copper or aluminum, or anodizing for aluminum.
The tests include X-Ray checking of welding quality, tightness test (leakage test), flow resistance test, thermal resistance test, temperature-rise test under different power, heat sink efficiency test and simulation test of heat sinks for different application conditions.
Kinto's heat sink features:
Applications in:
- High-power electronics
